Finite Element Analysis of Thermoelectric Refrigeration on the Heat Surface of the Chip Packaging
Year: 2014
Type: article
Abstract: On the basis of analysis of the principle of thermoelectric refrigeration and the research on the thermoelectric refrigeration technology and the thermal theoretical analysis of electronic components by domestic and foreign scholars, research on thermoelectric cooling of the uniform heat packaging surface from both the surface integral heat radiating and the local hot spot cooling of the chip by finite element numerical simulation and cooling both the chip and the heat from the whole surface of the local hot spots, using the finite element method of numerical simulation techniques Package uniform surface heat thermoelectric cooling study found the thermoelectric cooling hot surfaces in a uniform local cooling effect and temperature distribution, and pointed out that the chip thermoelectric cooling and thermal design layout surface will be in the future to improve the electroniccomponents of a hot heat important research direction.
Source: Applied Mechanics and Materials
Institution: University of South China
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W2093274540