The Effects of Composition and Design of Experiment on the Quality of Al-Ge Eutectic Bonding for Wafer Level Packaging
Year: 2013
Type: conference-paper
Abstract: The aluminum-germanium (Al-Ge) eutectic system was studied for the optimization of bonding parameters for hermetic sealing applications. The parameters that were varied included the ratio of aluminum to germanium, bonding temperature, force, and time. It was found that the critical eutectic ratio of Al to Ge produced a finer intermetallic distribution and better uniformity across wafers leading to higher shear strength. Design of experiment (DOE) was used to determine the most influential process parameters. Bond temperature and force had the largest effect on shear strength.
Source: ECS Transactions
Authors: Xin-Hua Huang, Chun-Wen Cheng, Ping-Yin Liu, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, David Huang, Cindy Colinge
Institution: Taiwan Semiconductor Manufacturing Company (Taiwan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W2093875498