Work

Wafer-Level Packaging of Micromechanical Resonators

Year: 2007

Type: article

Source: IEEE Transactions on Advanced Packaging

DOI: 10.1109/tadvp.2006.890220

Authors: Paul Jayachandran Joseph, Pejman Monajemi, Farrokh Ayazi, Paul A. Kohl

Institution: Georgia Institute of Technology

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2095834124

FWCI: 3.779

Cites: 29

Cited by: 39

Related to: 10