Work

Power semiconductor joining through sintering of silver nanoparticles: Evaluation of influence of parameters time, temperature and pressure on density, strength and reliability

Year: 2010

Type: conference-paper

Source: Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)

Authors: Matthias Knoerr, Andreas Schletz

Institution: Fraunhofer Institute for Integrated Systems and Device Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2095848836

FWCI: 6.845

Cites: 6

Cited by: 93

Related to: 10