Work

On the Applicability of Single-Walled Carbon Nanotubes as VLSI Interconnects

Year: 2009

Type: article

Source: IEEE Transactions on Nanotechnology

DOI: 10.1109/tnano.2009.2013945

Authors: N. Srivastava, Hong Li, F. Kreupl, K. Banerjee

Institutions: University of California, Santa Barbara, Mentor Graphics (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2096851523

FWCI: 8.134

Cites: 93

Cited by: 180

Related to: 10