Work

Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization

Year: 2009

Type: article

Source: Journal of Electronic Materials

DOI: 10.1007/s11664-009-0951-8

Authors: Hui Xu, Changqing Liu, Vadim V. Silberschmidt, Zhong Chen

Institutions: Loughborough University, Nanyang Technological University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2096878922

FWCI: 6.186

Cites: 27

Cited by: 80

Related to: 10