Hermetic packaging of resonators with vertical feedthroughs using a glass-in-silicon reflow process
Year: 2011
Type: conference-paper
Authors: R. M. Haque, D. E. Serrano, X. Gao, A. N.-Shirazi, V. Keesara, F. Ayazi, K. D. Wise
Institutions: University of Michigan, Georgia Institute of Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: National Science Foundation
OpenAlex ID: W2097326912