Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
Year: 2007
Type: article
Source: Journal of Electronic Materials
Authors: Tao Wang, Xu Chen, Guo-Quan Lu, Guang-Yin Lei
Institutions: Tianjin University, Virginia Tech
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2097414581