Work

Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound

Year: 2015

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2015.2442751

Authors: Yeonsung Kim, Dapeng Liu, Hohyung Lee, Ruiyang Liu, Dipak Sengupta, Seungbae Park

Institutions: Binghamton University, Analog Devices (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Analog Devices

OpenAlex ID: W2098662984

FWCI: 1.442

Cites: 31

Cited by: 31

Related to: 10