Work

High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

Year: 2007

Type: article

Source: IEEE Transactions on Advanced Packaging

DOI: 10.1109/tadvp.2007.898628

Authors: John Guofeng Bai, Jian Yin, Zhiye Zhang, Guo-Quan Lu, Jacobus Daniel van Wyk

Institutions: University of Washington, Virginia Tech

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Science Foundation, Virginia Polytechnic Institute and State University, Engineering Research Centers

OpenAlex ID: W2100822548

FWCI: 5.804

Cites: 18

Cited by: 182

Related to: 10