Work

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

Year: 2006

Type: article

Source: IEEE Transactions on Components and Packaging Technologies

DOI: 10.1109/tcapt.2005.853167

Authors: J.G. Bai, Z.Z. Zhang, J.N. Calata, G.-Q. Lu

Institution: Virginia Tech

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Virginia Polytechnic Institute and State University

OpenAlex ID: W2102914914

FWCI: 10.03

Cites: 19

Cited by: 382

Related to: 10