Work

A study on accelerated preconditioning test

Year: 2002

Type: conference-paper

Source: Electronic Packaging Technology Conference

DOI: 10.1109/eptc.1997.723893

Authors: Y. Sun, E.C. Wong, C.H. Ng

Institution: Texas Instruments (Singapore)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2103606474

FWCI: 0.356

Cites: 2

Cited by: 1

Related to: 10