Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs
Year: 2010
Type: article
Authors: Chuan Xu, Hong Li, Roberto Suaya, Kaustav Banerjee
Institution: University of California, Santa Barbara
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2106997452