Multiphysics modeling of integrated microfluidic-thermoelectric cooling for stacked 3D ICs
Year: 2003
Type: conference-paper
Authors: A. Furmanczyk, P. Wilkerson, A. Przekwas
Institution: CFD Research Corporation (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2107986059