Work

Electrochemical Behavior of Bis(β-diketonate)copper Complexes

Year: 2005

Type: article

Abstract: The use of copper to produce interconnects for microchip manufacture has prompted a renewed interest in its corrosion, deposition, and passivation processes. The aqueous electrochemistry of four bis(β-diketonate)copper complexes (where , tfacH, hfacH, and tmhdH) in aqueous media has been investigated. Equilibrium constants were used to calculate potential-pH diagrams, varying the β-diketone ligand, ligand and∕or copper concentrations, and the ionic strength of the buffer solution. The theoretical potential-pH diagrams showed good correlation to the experimental data obtained in aqueous solutions.

Source: Journal of The Electrochemical Society

DOI: 10.1149/1.2047387

Authors: Ginger M. Denison, Amber O. Evans, Carol A. Bessel, Dorothy W. Skaf, Royce W. Murray, Joseph M. DeSimone

Institutions: University of North Carolina at Chapel Hill, North Carolina Agricultural and Technical State University, Villanova University, North Carolina State University

Language: English

Topic: Corrosion Behavior and Inhibition

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: bronze

Funders: National Science Foundation, Villanova University, Division of Chemistry

Awards: G2560607304, Center for Environmentally Responsible Solvents and Processes