Work

Effect of chip die bonding on thermal resistance of high power LEDs

Year: 2012

Type: conference-paper

Source: I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems

DOI: 10.1109/itherm.2012.6231529

Authors: Tri Ayodha, Hun Sik Han, Joongnyon Kim, Seo Young Kim

Institutions: Korea Institute of Science and Technology, Korea University of Science and Technology, Korea Advanced Institute of Science and Technology, LG (South Korea)

Language: English

Topic: GaN-based semiconductor devices and materials

Subfield: Condensed Matter Physics

Field: Physics and Astronomy

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2114606619

FWCI:

Cites: 9

Cited by: 1

Related to: 10