Work

PicoServer: using 3D stacking technology to enable a compact energy efficient chip multiprocessor

Year: 2006

Type: conference-paper

Source: International Conference on Architectural Support for Programming Languages and Operating Systems (ASPLOS)

DOI: 10.1145/1168857.1168873

Authors: Taeho Kgil, Shaun D'Souza, Ali Saidi, Nathan Binkert, Ronald Dreslinski, Trevor Mudge, Steven Reinhardt, Krisztian Flautner

Institution: University of Michigan

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2117816012

FWCI: 28.49

Cites: 25

Cited by: 191

Related to: 10