Work

Reliability and Flexibility of Ultra-Thin Chip-on-Flex (UTCOF) Interconnects With Anisotropic Conductive Adhesive (ACA) Joints

Year: 2010

Type: article

Source: IEEE Transactions on Advanced Packaging

DOI: 10.1109/tadvp.2010.2052806

Authors: Su-Tsai Lu, Wen-Hwa Chen

Institutions: National Tsing Hua University, Industrial Technology Research Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Georgia Institute of Technology, Industrial Technology Research Institute, National Tsing Hua University, National Taiwan University

OpenAlex ID: W2118805732

FWCI: 2.72

Cites: 25

Cited by: 31

Related to: 10