Work

Interconnect scaling-the real limiter to high performance ULSI

Year: 2002

Type: conference-paper

Source: Technical digest - International Electron Devices Meeting/Technical digest

DOI: 10.1109/iedm.1995.499187

Author: M.T. Bohr

Institution: Intel (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2120062652

FWCI: 141.3

Cites: 6

Cited by: 563

Related to: 10