Work

A Three Dimensional Self-folding Package (SFP) for Electronics

Year: 2010

Type: article

Source: MRS Proceedings

DOI: 10.1557/proc-1249-f09-07

Authors: David Gracias, Jeong-Hyun Cho, Steve Hu

Institution: Johns Hopkins University

Language: English

Topic: Advanced Materials and Mechanics

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2120107036

FWCI: 0.609

Cites: 10

Cited by: 6

Related to: 10