Work

New high conductivity lead (Pb)-free conducting adhesives

Year: 2002

Type: conference-paper

Source: IEEE International Symposium on Electronics and the Environment (ISEE)

DOI: 10.1109/isee.1995.514971

Authors: S.K. Kang, T. Graham, S. Purushothaman, J. Roldan, R. Saraf

Institution: IBM Research - Thomas J. Watson Research Center

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Responsible consumption and production

Open Access status: closed

OpenAlex ID: W2123213334

FWCI: 1.067

Cites: 7

Cited by: 11

Related to: 10