Work

Thermal cycling simulation in electronic packages using molecular dynamic method

Year: 2005

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/esime.2005.1502768

Authors: H.B. Fan, E.K.L. Chan, C.K.Y. Wong, M.M.F. Yuen

Institution: Hong Kong University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2123871939

FWCI: 0.55

Cites: 12

Cited by: 3

Related to: 10