Work

Via processing options for MCM-D fabrication: excimer laser ablation vs. reactive ion etching

Year: 2002

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.1991.163975

Authors: T.G. Tessier, W.F. Hoffman, J.W. Stafford

Institution: Motorola (United States)

Language: English

Topic: Laser Material Processing Techniques

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2125733901

FWCI: 2.325

Cites: 11

Cited by: 11

Related to: 10