Work

Forming low resistance nano-scale contacts using solder reflow

Year: 2005

Type: conference-paper

Source: IEEE Conference on Nanotechnology (IEEE NANO)

DOI: 10.1109/nano.2005.1500826

Authors: Hongke Ye, Zhiyong Gu, T. Yu, A. Bernfeld, T. Leong, D.H. Gracias

Institution: Johns Hopkins University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Foundation

OpenAlex ID: W2127190048

FWCI: 1.65

Cites: 9

Cited by: 5

Related to: 10