Expansion of Utilizing Temperature Range of Bi2Te3/PbTe by FGM Forming
Year: 1999
Type: article
Abstract: FGM forming is one of promising methods to improve the efficiency of thermoelectric materials. Soldering is the most simple and feasible method to join thermoelectric materials. However, durability of the joined material at a high temperature is important for practical application. The purpose of this study is joining of Bi-Te and Pb-Te for expansion of utilizing temperature range with high performance by soldering. Te-Ag eutectic alloy (m.p.624K) was used as the solder. The FGM showed higher power factor than each monolithic material at the temperature range between 400K and 650K. Thermal stability of the joined material was investigated. It was found that the properties of the segmented FGM deteriorated after the joined part was heated over 520K.
Source: Materials science forum
Authors: M. Koshigoe, Ichiro Shiota, Isao A. Nishida
Institution: Salesian Polytechnic
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W2127453449