Fluxless Hermetic Lid Sealing Using Electroplated Sn-Rich Solder
Year: 2008
Type: article
Authors: Jong S. Kim, Pin J. Wang, Chin C. Lee
Institution: University of California, Irvine
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2128445450