Work

Material development of polymer/metal paste for flip-chip attach interconnection technology. Quarterly progress report, December 1, 1995--March 31, 1996

Year: 1996

Type: report

Abstract: In this report on Polymer/Metal Composite (PMC) adhesive the authors describe two aspects of the material that are crucial to its applicability as a viable material for Flip Chip Attach (FCA) technology. They describe the shelf-life of the material at room temperature and its effect on the adhesion. Then they discuss the electrical and mechanical behavior of PMC bond under strain. It is demonstrated that the bond can be subjected to well over 40% strain with insignificant change in its electrical properties.

DOI: 10.2172/226050

Authors: R Saraf, USDOE, Washington, DC (United States), J Roldan, C Sambucetti

Institutions: IBM (United States), IBM Research - Thomas J. Watson Research Center

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: green

OpenAlex ID: W2132499507

Cites: 1

Cited by:

Related to: 10