Work

Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

Year: 2002

Type: article

Source: IEEE Transactions on Electronics Packaging Manufacturing

DOI: 10.1109/tepm.2002.807719

Authors: Z. Zhang, Guo-Quan Lu

Institution: Virginia Tech

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2133314170

FWCI: 1.013

Cites: 9

Cited by: 230

Related to: 10