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How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core

Year: 2013

Type: conference-paper

Source: IEEE Custom Integrated Circuits Conference (CICC)

DOI: 10.1109/cicc.2013.6658541

Authors: Moongon Jung, Taigon Song, Yang Wan, Young-Joon Lee, Debabrata Mohapatra, Hong Wang, Greg Taylor, Devang Jariwala, Vijay Pitchumani, Patrick Morrow, Clair Webb, Paul Fischer, Sung Kyu Lim

Institutions: Georgia Institute of Technology, Intel (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2134071101

FWCI: 5.703

Cites: 6

Cited by: 20

Related to: 10