Work

Freestanding Three‐Dimensional Copper Foils Prepared by Electroless Deposition on Micropatterned Gels

Year: 2005

Type: article

Source: Advanced Materials

DOI: 10.1002/adma.200401010

Authors: S. K. Smoukov, K. J. M. Bishop, C. J. Campbell, B. A. Grzybowski

Institution: Northwestern University

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2134394080

FWCI: 2.534

Cites: 34

Cited by: 21

Related to: 10