Work

Flip-chip hermetic packaging of RF MEMS

Year: 2002

Type: conference-paper

Source: Microelectromechanical Systems Conference

DOI: 10.1109/memsc.2001.992750

Authors: P. Wilkerson, M. Kranz, A. Przekwas, T. Hudson

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2135763437

FWCI: 1.067

Cites: 2

Cited by: 15

Related to: 10