Year: 2004
Type: article
Abstract: We demonstrate a three-dimensional (3D) bulk silicon microcooler, which has the advantages of high cooling power densities and is less dependent on thermoelectric element’s thickness as compared with the same device with one-dimensional (1D) geometry. We measured a maximum cooling of 1.2°C for a 40×40μm2 area bulk silicon microcooler device, which is equivalent to an estimated cooling power density of 580W∕cm2. In this unique geometry, both current and heat spreading in 3D allows the maximum cooling temperature to exceed the conventional 1D thermoelectric model’s theoretical limit 0.5ZTc2.
Source: Applied Physics Letters
DOI: 10.1063/1.1800290
Authors: Yan Zhang, Ali Shakouri, Gehong Zeng
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W2136104106