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CMOS multichip module test vehicle with TAB'd components

Year: 2002

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.1991.163958

Authors: P. Wesling, J. Shiao, T. Chung, T. Pan, D. de Simone

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2136387773

FWCI: 1.422

Cites: 8

Cited by: 5

Related to: 10