Work

Wafer-level MEMS packaging via thermally released metal-organic membranes

Year: 2006

Type: article

Source: Journal of Micromechanics and Microengineering

DOI: 10.1088/0960-1317/16/4/010

Authors: Pejman Monajemi, Paul J Joseph, Paul A Kohl, Farrokh Ayazi

Institution: Georgia Institute of Technology

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2139229801

FWCI: 6.738

Cites: 26

Cited by: 58

Related to: 10