Work

Thermal characterization of thin film Cu interconnects for the next generation of microelectronic devices

Year: 2004

Type: conference-paper

Source: I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems

DOI: 10.1109/itherm.2004.1318336

Authors: S. Shojaei-Zadeh, Shu Zhang, Wenjun Liu, Yizhang Yang, S.M. Sadeghipour, M. Asheghi, P. Sverdrup

Institutions: Carnegie Mellon University, Intel (United States), Stanford University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: National Science Foundation

OpenAlex ID: W2140278348

FWCI: 3.873

Cites: 22

Cited by: 12

Related to: 10