Low temperature wafer direct bonding
Year: 1994
Type: article
DOI: 10.1109/84.285720
Authors: Qin-Yi Tong, G. Cha, R. Gafiteanu, U. Gosele
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2141436722