Work

Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation

Year: 1998

Type: article

Source: Journal of materials research/Pratt's guide to venture capital sources

DOI: 10.1557/jmr.1998.0186

Authors: R-M. Keller, S. P. Baker, E. Arzt

Institutions: University of Stuttgart, Max Planck Society

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: Deutsche Forschungsgemeinschaft

OpenAlex ID: W2141660633

FWCI: 11.92

Cites: 21

Cited by: 259

Related to: 10