Work

Reliability assessment of sintered nano-silver die attachment for power semiconductors

Year: 2010

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2010.5702605

Authors: Matthias Knoerr, Silke Kraft, Andreas Schletz

Institution: Fraunhofer Institute for Integrated Systems and Device Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: European Commission

OpenAlex ID: W2142210263

FWCI: 14.97

Cites: 12

Cited by: 187

Related to: 10