3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration
Year: 2001
Type: article
Source: Proceedings of the IEEE
DOI: 10.1109/5.929647
Authors: K. Banerjee, S.J. Souri, P. Kapur, K.C. Saraswat
Institutions: Stanford SystemX Alliance, Stanford University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2144149750