Work

Computational simulation of underfill encapsulation of flip-chip ICs. I. Flow modeling and surface-tension effects

Year: 2002

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.1998.678912

Authors: H. Yang, S. Bayyuk, A. Krishnan, A. Przekwas, L. Nguyen, P. Fine

Institution: CFD Research Corporation (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2144201461

FWCI: 0.356

Cites: 7

Cited by: 7

Related to: 10