Work

Direct liquid cooling module with high reliability solder joining technology for automotive applications

Year: 2013

Type: conference-paper

Source: IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs

DOI: 10.1109/ispsd.2013.6694408

Authors: Akira Morozumi, Hiroaki Hokazono, Yoshitaka Nishimura, Yoshinari Ikeda, Yoichi Nabetani, Yoshikazu Takahashi

Institutions: Fuji Electric (Japan), University of Yamanashi

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2144906639

FWCI: 5.702

Cites: 2

Cited by: 39

Related to: 10