Work

An integrated air gap structure to achieve high-performance TSV interconnects for 28nm 3D-IC integration

Year: 2013

Type: conference-paper

Source: Symposium on VLSI Technology

Authors: E.B. Liao, Kai-Yu Cheng, Y. H. Chen, H. Teng, Yuan‐Chieh Tseng, W. C. Tsai, J. H. Chen, Tzu‐Chau Lin, K.F. Yang, Yirong Lin, Hun-Hsien Chang, T.S. Wei, H. Y. Chen, M. F. Chen, Chaoping Hsieh, Ting Wu, Cheng‐Hsien Wu, Da‐Yuan Shih, W.C. Chiou, Shin-Puu Jeng, Chenghui Yu

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2146167014

FWCI: 0.815

Cites:

Cited by: 3

Related to: 20