Work

Lead Forming and Outer Lead Bond Pattern Design for Tape-Bonded Hybrids

Year: 1978

Type: article

Source: IEEE Transactions on Components Hybrids and Manufacturing Technology

DOI: 10.1109/tchmt.1978.1135305

Authors: W. Rodrigues de Miranda, R. Oswald, D. Brown

Institutions: Honeywell (United States), Envigo (United Kingdom)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2147170046

FWCI: 1.972

Cites: 6

Cited by: 6

Related to: 10