Stamp-and-stick room-temperature bonding technique for microdevices
Year: 2005
Type: article
Authors: S. Satyanarayana, R.N. Karnik, A. Majumdar
Institution: University of California, Berkeley
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2148366851