Back-End-of-Line and Micro-C4 Thermal Resistance Contributions to 3-D Stack Packages
Year: 2011
Type: article
Authors: Jamil Wakil, Evan G. Colgan, Shaochen Chen
Institutions: IBM (United States), The University of Texas at Austin
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2149890056