Work

Very High-Temperature Joints Between Si and Ag–Copper Substrate Made at Low Temperature Using InAg System

Year: 2008

Type: article

Source: IEEE Transactions on Components and Packaging Technologies

DOI: 10.1109/tcapt.2008.2001195

Authors: Jong Sung Kim, Pin J. Wang, Chin C. Lee

Institution: University of California, Irvine

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2152765746

FWCI: 2.389

Cites: 18

Cited by: 17

Related to: 10