Work

Evaluation of contact resistance for isotropic electrically conductive adhesives

Year: 1995

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology Part B

DOI: 10.1109/96.386265

Authors: M.A. Gaynes, R.H. Lewis, R.F. Saraf, J.M. Roldan

Institutions: IBM (United States), IBM Research - Thomas J. Watson Research Center

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2153383020

FWCI: 2.876

Cites: 9

Cited by: 69

Related to: 10