Film transfer and bonding techniques for covering single-chip ejector array with microchannels and reservoirs
Year: 2005
Type: article
Authors: Jae Wan Kwon, Hongyu Yu, Eun Sok Kim
Institutions: University of Southern California, University of Missouri
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2153668283