Ultra-thin electronic device package
Year: 2000
Type: article
DOI: 10.1109/6040.826758
Authors: K.Y. Chen, R.L.D. Zenner, M. Ameson, D. Mountain
Institution: 3M (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2154320899