TSV-based, modular and collision detectable face-to-back shared bus design
Year: 2013
Type: conference-paper
Authors: Zhenqian Zhang, Paul Franzon
Institution: North Carolina State University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2155179489